Copyright Notice: This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders, e.g. publishers like IEEE. All persons copying this information are expected to adhere to the terms and constraints invoked by each author’s or publisher’s copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. Please refer to the original publication via the DOI and request the explicit permission to reuse or repost the work.

2021

  1. Y. Baumgartner, D. Caimi, M. Sousa, M. Hopstaken, Y. Salamin, B. Baeuerle, B. I. Bitachon, J. Leuthold, J. Faist, B. J. Offrein, and L. Czornomaz, “High-speed CMOS-compatible III-V on Si membrane photodetectors,” Opt. Express, vol. 29, no. 1, pp. 509-516, 2021. DOI: 10.1364/OE.414013.

2020

  1. P. Stark et al., “Heterogeneous Co-Integration of BTO/Si and III-V Technology on a Silicon Photonics Platform,” Optical Fiber Communications Conference and Exhibition (OFC), San Diego, CA, USA, 2020. DOI: 10.1364/OFC.2020.T3B.3.
  2. G. Belfiore et al., “A 50–20 Gb/s, 80 mW Photonic Receiver With 59–70 dBΩ Gain and 12.3–8.2 pA/√Hz Input-Referred Noise,” IEEE Photonics Technology Letters, vol. 32, no. 15, pp. 921-924, 2020. DOI: 10.1109/LPT.2020.3003168.

2019

  1. Y. Baumgartner, M. Seifried, C. Caer, P. Stark, D. Caimi, J. Faist, B.J. Offrein, L. Czornomaz, “Novel CMOS-Compatible Ultralow Capacitance Hybrid III-V/Si Photodetectors Tested up to 32 Gbps NRZ“, Optical Fiber Communication Conference (OFC), San Diego, USA, 08-12 March, 2019. DOI: 10.1364/OFC.2019.Th3B.3

2018

  1. Benjamin Wohlfeil, Gilda Raoof Mehrpoor, Annika Dochhan, Danish Rafique, Michael Eiselt and Jörg-Peter Elbers, “Photonic integrated circuits for data center interconnects“, International Conference on Photonics in Switching and Computing, Limassol, Cyprus, 19-21 September, 2018. DOI: 10.1109/PS.2018.8751412
  2. Giuglea, G. Belfiore, M. Khafaji, R. Henker, D. Petousi, G. Winzer, L. Zimmermann and F. Ellinger, “Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder Modulators“, International Conference on Photonics in Switching and Computing, Limassol, Cyprus, 19-21 September, 2018. DOI: 10.1109/PS.2018.8751239
  3. Yannick Baumgartner, Charles Caër, Marc Seifried, Gustavo Villares, D. Caimi, Thomas Morf, Jérôme Faist, Bert J. Offrein, Lukas Czornomaz, “CMOS-Compatible Hybrid III-V/Si Photodiodes Using a Lateral Current Collection Scheme”, European Conference on Optical Communication (ECOC), Rome, Italy, 23-27 Sept. 2018. Best Student Paper Award, DOI: 10.1109/ECOC.2018.8535117
  4. A. Giuglea, G. Belfiore, M. Khafaji, R. Henker and F. Ellinger, “A 30 Gb/s High-Swing, Open-Collector Modulator Driver in 250 nm SiGe BiCMOS,” IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS), Windsor, Ontario, Canada, August 5-8, 2018. DOI: 10.1109/MWSCAS.2018.8624057
  5. Seifried et al., “Monolithically Integrated CMOS-Compatible III–V on Silicon Lasers,” in IEEE Journal of Selected Topics in Quantum Electronics, vol. 24, no. 6, Nov.-Dec. 2018. DOI: 10.1109/JSTQE.2018.2832654
  6. Dangel et al., “Polymer Waveguides Enabling Scalable Low-Loss Adiabatic Optical Coupling for Silicon Photonics,” in IEEE Journal of Selected Topics in Quantum Electronics, vol. 24, no. 4, July-Aug. 2018. DOI: 10.1109/JSTQE.2018.2812603
  7. T. Rokkas, I. Neokosmidis and I. Tomkos, “Cost and Power Consumption Comparison of 400 Gbps Intra-Datacenter Transceiver Modules,” 20th International Conference on Transparent Optical Networks (ICTON), Bucharest, Romania, 1-5 July 2018. DOI: 10.1109/ICTON.2018.8473747
  8. N. Neumann, Z. Al-Husseini and D. Plettemeier, “Nonlinearity, noise and bandwidth influence for PAM4 modulation format,” Photonic Networks, 19th ITG-Symposium, Leipzig, Germany, 2018.
  9. Christos A. Thraskias, Eythimios N. Lallas , Niels Neumann, Laurent Schares, Bert J. Offrein, Ronny Henker, Dirk Plettemeier, Frank Ellinger, Juerg Leuthold, and Ioannis Tomkos, “Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications,” IEEE Communications Surveys and Tutorials, vol. 20, no. 4, pp. 2758-2783, 2018. DOI: 10.1109/COMST.2018.2839672
  10. T. Rokkas, I. Neokosmidis, B. Shariati, and I. Tomkos, “Techno-Economic Evaluations of 400G Optical Interconnect Implementations for Datacenter Networks,” Optical Fiber Communication Conference (OFC), San Diego, USA, 11–15 March, 2018, paper M1A.1.DOI: 10.1364/OFC.2018.M1A.1
  11. P. Torres-Ferrera, M.A. García-Yáñez, R. Gutiérrez-Castrejón, I. Tomkos, “Coherent optical WDM systems for 1.6 Tb/s Ethernet over 40 km of single-mode fiber,” Optical Fiber Technology,  vol. 43, pp. 180-187, 2018. DOI: 10.1016/j.yofte.2018.01.021
  12. B. Mayer, S. Mauthe, Y. Baumgartner, S. Wirths, J. Winniger, P. Staudinger, H. Schmid, M. Souza, L. Czornomaz, K. E. Moselund, “Microcavity III-V lasers monolithically grown on silicon,” Proc. SPIE 10540, Quantum Sensing and Nano Electronics and Photonics XV, 105401D, 26 January 2018. DOI: 10.1117/12.2291735

2017

  1. S. Lischke et al., “Performance improvement of a monolithically integrated C-Band receiver enabled by an advanced photonic BiCMOS process,” IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), Miami, USA, pp. 50-53, Oct. 2017. Best Paper Award; DOI: 10.1109/BCTM.2017.8112909
  2. Y. Baumgartner, B. Mayer, M. Sousa, D. Caimi, K. Moselund and L. Czornomaz, “Monolithic integration of InAlAs/InGaAs quantum-well on InP-OI micro-substrates on Si for infrared light sources,” IEEE 14th International Conference on Group IV Photonics (GFP), Berlin, Germany, pp. 173-174, 2017. Best Student Paper Award; DOI: 10.1109/GROUP4.2017.8082252
  3. S. Lischke, D. Knoll, D. Wolansky, M. Kroh, A. Peczek, and L. Zimmermann, “High-Speed, High-Responsivity Ge Photodiode with NiSi Contacts for an Advanced Photonic BiCMOS Technology”, Proceeding IEEE International Conference on Group IV Photonics, Berlin, Germany, 23-25 August 2017.
  4. L. Zimmermann, “Transmitters in Photonic BiCMOS,” Advanced Photonics, New Orleans, Louisiana, USA, 24–27 July 2017, paper PW2D.1. DOI: 10.1364/PS.2017.PW2D.1
  5. B. Shariati, N. Diamantopoulos, D. Klonidis, J. Comellas and I. Tomkos, “On the benefits of FMF based data center interconnection utilizing MIMO-less PAM-M transceivers,” 19th International Conference on Transparent Optical Networks (ICTON), Girona, Spain, 2-6 July 2017. DOI: 10.1109/ICTON.2017.8024961
  6. P. Torres-Ferrera, R. Gutiérrez-Castrejón and I. Tomkos, “Multi-format 800 – 1600 Gb/s coherent transceiver for inter-data centre interconnects over SMF,” 19th International Conference on Transparent Optical Networks (ICTON), Girona, Spain, 2-6 July 2017. DOI: 10.1109/ICTON.2017.8024831
  7. V. Vgenopoulou, N. Raptis, E. Grivas and I. Tomkos, “Designing the next generation of intra-and inter-datacentres interconnects,” 19th International Conference on Transparent Optical Networks (ICTON), Girona, Spain, 2-6 July 2017. DOI: 10.1109/ICTON.2017.8024830
  8. S. Lischke et al., “Monolithic photonic BiCMOS technology for high-speed receiver applications,” 19th International Conference on Transparent Optical Networks (ICTON), Girona, Spain, 2-6 July 2017.DOI:  10.1109/ICTON.2017.8024829
  9. M. Seifried et al., “CMOS-embedded lasers for advanced silicon photonic devices,” 19th International Conference on Transparent Optical Networks (ICTON), Girona, Spain, 2-6 July 2017. DOI: 10.1109/ICTON.2017.8024828
  10. D. Rafique, N. Eiselt, H. Griesser, B. Wohlfeil, M. Eiselt and J. P. Elbers, “Digital pre-emphasis based system design trade-offs for 64 Gbaud coherent data center interconnects,” 19th International Conference on Transparent Optical Networks (ICTON), Girona, Spain, 2-6 July 2017.
  11. H. Hahn et al., “Towards electro-optical integration of hybrid III-V on Si lasers into the BEOL of a CMOS technology,” 75th Annual Device Research Conference (DRC), South Bend, IN, USA, 25-28 June 2017.
  12. Herwig Hahn, Marilyne Sousa and Lukas Czornomaz, “Low-resistive, CMOS-compatible ohmic contact schemes to moderately doped n-InP,” Journal of Physics D: Applied Physics, Vol. 50, No. 23, p. 235102, May 2017. DOI: 10.1088/1361-6463/aa6f7a
  13. Jörg-Peter Elbers, Danish Rafique and Benjamin Wohlfeil, “Silicon Photonics-Based Transceivers for Exascale Data Centers,” Photonics in Germany, pp. 40-41, 01 April 2017.
  14. Benjamin Wohlfeil, Danish Rafique, and Michael Eiselt, “Photonic Integrated Circuits for Data Center Interconnects,” European Conference on Integrated optics (ECIO), Ghent , Belgium, 24-26 April 2017.
  15. N. Diamantopoulos, B. Shariati and I. Tomkos, “On the power consumption of MIMO processing and its impact on the performance of SDM networks,” Optical Fiber Communications Conference and Exhibition (OFC), Los Angeles, USA, 19-23 March 2017. DOI: 10.1364/OFC.2017.Th2A.18
  16. D. Rafique, H. Griesser and J. P. Elbers, “Enabling 64Gbaud coherent optical transceivers,” Optical Fiber Communications Conference and Exhibition (OFC), Los Angeles, CA, USA, 19-23 March 2017. DOI: 10.1364/OFC.2017.W2A.25

2016

  1. D. Petousi, P. Rito,  St. Lischke, D. Knoll, I. Garcia Lopez, M. Kroh, R. Barth, Ch. Mai, A.C. Ulusoy, A. Peczek, G. Winzer, K. Voigt, D. Kissinger, K. Petermann, L. Zimmermann, “Monolithically integrated high-extinction-ratio MZM with a segmented driver in photonic BiCMOS“, IEEE Photonics Technology Letters, vol. 28, no. 24, pp.2866-2869, December 2016. DOI: 10.1109/LPT.2016.2624700
  2. S. Lischke, D. Knoll, S. Tolunay-Wipf, C. Wipf, C. Mai, A. Fox, F. Herzel, and M. Kaynak, “Side-Use of a Ge p-i-n Photo Diode for Electrical Application in a Photonic BiCMOS Technology”, Proceedings IEEE BCTM, New Brunswick, NJ, USA, 25-27 September 2016. DOI: 10.1109/BCTM.2016.7738970
  3. S.Lischke, D. Knoll, C. Mai, M. Kroh, D. Schmidt, A. Peczek, J. Kreißl, J.-M. Lee, M. Kim, W.-Y. Choi, and L. Zimmermann, “Design Effects on the Performance of High-Speed Ge Photo Detectors”, Proceeding IEEE International Conference on Group IV Photonics, Shanghai, China, 24-26 August 2016. DOI: 10.1109/GROUP4.2016.7739076

 

Copyright Notice: This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders, e.g. publishers like IEEE. All persons copying this information are expected to adhere to the terms and constraints invoked by each author’s or publisher’s copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. Please refer to the original publication via the DOI and request the explicit permission to reuse or repost the work.